发明名称 |
Thin-film transistor and method for manufacturing thin-film transistor |
摘要 |
A method for manufacturing a thin-film transistor, includes: preparing a substrate; forming a gate electrode above the substrate; forming a gate insulating layer above the gate electrode; forming a semiconductor film above the gate insulating layer; forming, above the semiconductor film, a protective layer comprising an organic material; forming a source electrode and a drain electrode above the protective layer; forming a semiconductor layer patterned, by performing dry etching on the semiconductor film; removing at least a portion of a region of an altered layer, the region contacting the semiconductor layer, the altered layer being a surface layer of the protective layer that is altered by the dry etching; and forming a passivation layer having a major component identical to a major component of the protective layer so as to contact the semiconductor layer in a region in which the altered layer has been removed. |
申请公布号 |
US8993383(B2) |
申请公布日期 |
2015.03.31 |
申请号 |
US201314130939 |
申请日期 |
2013.05.29 |
申请人 |
Panasonic Corporation |
发明人 |
Kishida Yuji;Yokota Kazuhiro;Kanegae Arinobu |
分类号 |
H01L21/00;H01L29/04;H01L29/786;G02F1/1368;H01L29/66;H01L27/12;H01L27/32 |
主分类号 |
H01L21/00 |
代理机构 |
Greenblum & Bernstein, P.L.C. |
代理人 |
Greenblum & Bernstein, P.L.C. |
主权项 |
1. A method for manufacturing a thin-film transistor, the method comprising:
preparing a substrate; forming a gate electrode above the substrate; forming a gate insulating layer above the gate electrode; forming a semiconductor film above the gate insulating layer; forming, above the semiconductor film, an etch-stopper layer comprising an organic material; forming a source electrode and a drain electrode that are opposed to each other, each of the source electrode and the drain electrode having at least a portion located above the etch-stopper layer; forming a semiconductor layer patterned, by performing dry etching on the semiconductor film; removing at least a portion of a region of an altered layer, the region contacting the semiconductor layer, the altered layer being a surface layer of the etch-stopper layer that is (i) exposed from the source electrode and the drain electrode and (ii) altered by the dry etching; and forming a passivation layer so as to contact the semiconductor layer in a region in which the altered layer has been removed, the passivation layer having a major component identical to a major component of the etch-stopper layer. |
地址 |
Osaka JP |