Method for forming sputter target assemblies having a controlled solder thickness

摘要

The present invention relates to a method and apparatus of forming a sputter target assembly having a controlled solder thickness. In particular, the method includes the introduction of a bonding foil, between the backing plate and the sputter target, wherein the bonding foil is an ignitable heterogeneous stratified structure for the propagation of an exothermic reaction.

主权项

1. A sputter target assembly, comprising:
an untapered ferromagnetic sputter target, a backing plate and a bonding foil, disposed between the backing plate and the ferromagnetic sputter target, wherein the bonding foil is an ignitable heterogeneous stratified structure for the propagation of an exothermic reaction in order to bond the ferromagnetic sputter target to the backing plate without affecting the microstructure or the flatness of the ferromagnetic sputter target across an interface of the backing plate and the ferromagnetic sputter target in the formation of the sputter target assembly, wherein said ferromagnetic sputter target has a magnetic flux across the ferromagnetic sputter target that is symmetrically distributed.