Circuit device and method of manufacturing the same

摘要

Provided is a circuit device in which encapsulating resin to encapsulate a circuit board is optimized in shape, and a method of manufacturing the circuit device. A hybrid integrated circuit device, which is a circuit device according to the present invention includes a circuit board, a circuit element mounted on a top surface of the circuit board, and encapsulating resin encapsulating the circuit element, and coating the top surface, side surfaces, and a bottom surface of the circuit board. In addition, the encapsulating resin is partly recessed and thereby provided with recessed areas at two sides of the circuit board. The providing of the recessed areas reduces the amount of resin to be used, and prevents the hybrid integrated circuit device from being deformed by the cure shrinkage of the encapsulating resin.

主权项

1. A circuit device comprising:
a circuit board having a conductive pattern and a circuit element mounted on a top surface of the circuit board; encapsulating resin coating the top surface, side surfaces, and a bottom surface of the circuit board; leads fixed to the circuit board and arranged along a first side-edge and a second side-edge of the encapsulating resin, wherein each of the leads has an end drawn from the encapsulating resin; a first recessed area formed in the encapsulating resin and at least partially disposed between a third side-edge of the encapsulating resin and the circuit board, wherein:
the first recessed area is spaced apart from the third side-edge of the encapsulating resin and a fourth side-edge of the encapsulating resin;the first recessed area is on a first side of the encapsulating resin and extends along a thickness direction of the circuit device;the first recessed area comprises a bottom surface formed of the encapsulating resin;the bottom surface of the first recessed area is spaced apart from a second side of the encapsulating resin;a first portion of the first recessed area is located above the circuit board; anda second portion of the first recessed area is located between the third side-edge of the encapsulating resin and the circuit board.