| 摘要 |
<p>The present invention relates to a ground expansion structure for a flexible circuit board. According to the present invention, there is provided a ground expansion structure for a flexible circuit board including a base layer constituting a base of the flexible circuit board, a circuit pattern and a ground formed on a top surface of the base layer, and an insulating layer laminated on upper portions of the circuit pattern and the ground to electrically insulate a top surface of the circuit pattern. The ground expansion structure for a flexible circuit includes an silver (Ag) conductive layer formed on a top surface of the insulating layer through a sputtering scheme; a protective film laminated on a top surface of the Ag conductive layer to protect the top surface of the Ag conductive layer and having a through-hole formed at a place corresponding to that of the ground of the flexible circuit board; a conductive adhesive filled into the through-hole of the protective film while being coated on the top surface of the protective film; and a ground expansion plate stacked on the top surface of the conductive adhesive to be electrically connected to the ground of the flexible circuit board through the conductive adhesive filled into the through-hole, thereby expanding the ground. According to the ground expansion structure for a flexible circuit board of the present invention, since the ground expansion plate stacked is electrically connected to the ground of the flexible circuit board through the conductive adhesive filling the through-hole after the protective film provided with the through-hole is stacked on the circuit pattern of the flexible circuit board, the ground property of the flexible circuit board is improved. Therefore, there may be provided a ground expansion structure for a flexible circuit board which may prepare a light and slim structure with a small size, which is the tend of electronic appliances produced in recent years.</p> |
