| 摘要 |
<p>An object of the present invention is to provide a resin composition showing high heat resistance even in low-temperature curing and an electrical device using the resin composition. The object is solved by a thermosetting resin composition comprising (A) a compound of an oligomer having two or more of radical-polymerizable substituent X of which binding energy of repeated structure is higher than binding energy of carbon-carbon formed by the substituent X; (B) a compound having a polymerizable substituent highly reactive with the substituent X; and (C) a polymerization initiator.</p> |
