发明名称 High strength and high thermal conductivity copper alloy tube and method for producing the same
摘要 A high strength and high thermal conductivity copper alloy tube contains: Co of 0.12 to 0.32 mass %; P of 0.042 to 0.095 mass %; and Sn of 0.005 to 0.30 mass %, wherein a relationship of 3.0≦([Co]−0.007)/([P]−0.008)≦6.2 is satisfied between a content [Co] mass % of Co and a content [P] mass % of P, and the remainder includes Cu and inevitable impurities. Even when a temperature is increased by heat generated by a drawing process, a recrystallization temperature is increased by uniform precipitation of a compound of Co and P and by solid-solution of Sn. Thus, the generation of recrystallization nucleuses is delayed, thereby improving heat resistance and pressure resistance of the high strength and high thermal conductivity copper alloy tube.
申请公布号 US8986471(B2) 申请公布日期 2015.03.24
申请号 US200812514680 申请日期 2008.11.10
申请人 Mitsubishi Shindoh Co., Ltd. 发明人 Oishi Keiichiro
分类号 B21C1/00;C22C9/06;C22F1/08;B21C23/00;B21C23/08;C22C9/02;F28F21/08 主分类号 B21C1/00
代理机构 Griffin & Szipl, P.C. 代理人 Griffin & Szipl, P.C.
主权项 1. A high strength and high thermal conductivity copper alloy tube subjected to a drawing process, wherein the copper alloy tube has an alloy composition comprising: Co of 0.12 to 0.32 mass %; P of 0.042 to 0.095 mass %; Sn of 0.005 to 0.30 mass %; and at least one of Ni of 0.01 to 0.15 mass % and Fe of 0.005 to 0.07 mass %, wherein relationships of 3.0≦([Co]+0.85×[Ni]+0.75×[Fe]−0.007)/([P]−0.008)≦6.2 and 0.015≦1.5×[Ni]+3×[Fe]≦[Co] are satisfied, wherein [Co] is the content in mass % of Co, [Ni] is the content in mass % of Ni, [Fe] is the content in mass % of Fe, and [P] is the content in mass % of P, and the remainder includes Cu and inevitable impurities, wherein a recrystallization ratio of a metal structure of a drawing-processed portion of the copper alloy tube subjected to the drawing process is 50% or less, or a recrystallization ratio of a heat-influenced portion subject to the drawing process is 20% or less.
地址 Tokyo JP