发明名称 |
High strength and high thermal conductivity copper alloy tube and method for producing the same |
摘要 |
A high strength and high thermal conductivity copper alloy tube contains: Co of 0.12 to 0.32 mass %; P of 0.042 to 0.095 mass %; and Sn of 0.005 to 0.30 mass %, wherein a relationship of 3.0≦([Co]−0.007)/([P]−0.008)≦6.2 is satisfied between a content [Co] mass % of Co and a content [P] mass % of P, and the remainder includes Cu and inevitable impurities. Even when a temperature is increased by heat generated by a drawing process, a recrystallization temperature is increased by uniform precipitation of a compound of Co and P and by solid-solution of Sn. Thus, the generation of recrystallization nucleuses is delayed, thereby improving heat resistance and pressure resistance of the high strength and high thermal conductivity copper alloy tube. |
申请公布号 |
US8986471(B2) |
申请公布日期 |
2015.03.24 |
申请号 |
US200812514680 |
申请日期 |
2008.11.10 |
申请人 |
Mitsubishi Shindoh Co., Ltd. |
发明人 |
Oishi Keiichiro |
分类号 |
B21C1/00;C22C9/06;C22F1/08;B21C23/00;B21C23/08;C22C9/02;F28F21/08 |
主分类号 |
B21C1/00 |
代理机构 |
Griffin & Szipl, P.C. |
代理人 |
Griffin & Szipl, P.C. |
主权项 |
1. A high strength and high thermal conductivity copper alloy tube subjected to a drawing process, wherein the copper alloy tube has an alloy composition comprising:
Co of 0.12 to 0.32 mass %; P of 0.042 to 0.095 mass %; Sn of 0.005 to 0.30 mass %; and at least one of Ni of 0.01 to 0.15 mass % and Fe of 0.005 to 0.07 mass %, wherein relationships of 3.0≦([Co]+0.85×[Ni]+0.75×[Fe]−0.007)/([P]−0.008)≦6.2 and 0.015≦1.5×[Ni]+3×[Fe]≦[Co] are satisfied, wherein [Co] is the content in mass % of Co, [Ni] is the content in mass % of Ni, [Fe] is the content in mass % of Fe, and [P] is the content in mass % of P, and the remainder includes Cu and inevitable impurities, wherein a recrystallization ratio of a metal structure of a drawing-processed portion of the copper alloy tube subjected to the drawing process is 50% or less, or a recrystallization ratio of a heat-influenced portion subject to the drawing process is 20% or less. |
地址 |
Tokyo JP |