Copper pillar full metal via electrical circuit structure

摘要

An electrical interconnect including a first circuitry layer with a first surface and a second surface. At least a first dielectric layer is printed on the first surface of the first circuitry layer to include a plurality of first recesses. A conductive material is deposited in a plurality of the first recesses to form a plurality of first conductive pillars electrically coupled to, and extending generally perpendicular to, the first circuitry layer. At least a second dielectric layer is printed on the first dielectric layer to include a plurality of second recesses generally aligned with a plurality of the first conductive pillars. A conductive material is deposited in a plurality of the second recesses to form a plurality of second conductive pillars electrically coupled to, and extending parallel the first conductive pillars.

主权项

1. A method of making an electrical interconnect comprising the steps of:
providing a first circuitry layer comprising a first surface and a second surface; applying at least a first dielectric layer on the first surface of the first circuitry layer to include a plurality of first recesses; plating a conductive material that substantially fills a plurality of the first recesses comprising a plurality of first conductive pillars electrically coupled to, and extending generally perpendicular to, the first circuitry layer; planarizing the first conductive pillars and the first dielectric layer before applying the second dielectric layer; applying at least a second dielectric layer on the first dielectric layer to include a plurality of second recesses generally aligned with a plurality of the first conductive pillars; plating a conductive material that substantially fills a plurality of the second recesses comprising a plurality of second conductive pillars electrically coupled to, and extending parallel to the first conductive pillars; and electrically coupling contact pads on an IC device to a plurality of the second conductive pillars.