发明名称 CIRCUIT DEVICE
摘要 PROBLEM TO BE SOLVED: To prolong a spatial distance between a conductor and a bus bar.SOLUTION: A metal substrate 41 has a metal plate 42. The metal substrate 41 has an insulating layer 43 on one surface of the metal plate 42. A conductive pattern 47, which is patterned in a desired shape, is bonded to the insulating layer 43. A bus bar 51 is bonded to the conductive pattern 47. A portion of the inner peripheral surface of an insertion hole 52 on the metal substrate 41 side is a separated portion 55. A portion different from the separated portion 55 of the inner peripheral surface of the insertion hole 52 is a contracted surface 56. The separated portion 55 inclines so as to be spaced apart from the metal plate 42 as it proceeds to the contracted surface 56 from a contact portion 54. The bus bar 51 has, on an opposite surface 53 facing the metal substrate 41, the contact portion 54 in contact with the metal substrate 41 and the separated portion 55 spaced apart from the metal substrate 41.
申请公布号 JP2015056609(A) 申请公布日期 2015.03.23
申请号 JP20130190757 申请日期 2013.09.13
申请人 TOYOTA INDUSTRIES CORP 发明人 MORISAKU NAOTO;UEDA HIROMI;KATO TAKAYUKI
分类号 H01L25/07;H01L23/12;H01L25/18;H05K1/02;H05K7/06 主分类号 H01L25/07
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