| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which can be cured at a low temperature and gives a cured film excellent in chemical resistance.SOLUTION: The photosensitive resin composition contains a phenolic resin (A), a photoacid generator (B), a solvent (C), and a nonionic surfactant (D). The phenolic resin (A) contains a phenolic resin (A1) modified with a C4-C100 compound having at least one functional group selected from the group consisting of an ether bond, a hydroxyl group, an ester bond, a carboxyl group, a thioether bond, a thiol group, a thioester bond, a sulfo group, a sulfonyl group, a urethane bond, a urea bond, a thiourethane bond, and a thiourea bond. |
