| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which peeling of an exposed metal plate is prevented to improve heat dissipation.SOLUTION: There is provided a semiconductor device 10 including a metal plate 1, a plurality of semiconductor chips 3, an insulating layer 6a, a wiring layer 6b, an external connection terminal 19, and a sealing resin portion 2. The metal plate 1 has a first surface 1a having a rectangular shape. The plurality of semiconductor chips 3 are stacked on a second surface 1g of the metal plate 1. The insulating layer 6a and the wiring layer 6b are provided on the opposite side of the metal plate 1 with respect to the semiconductor chips 3. The external connection terminal 19 is provided on the opposite side of the semiconductor chips 3 with respect to the insulating layer 6a and the wiring layer 6b. The sealing resin portion 2 seals the semiconductor chips 3 while exposing the first surface 1a of the metal plate 1. At least one facing surfaces of outer peripheral surfaces continuing from peripheral sides of the first surface 1a of the metal plate 1 is covered with the sealing resin portion 2. |
