| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a lead frame assembly capable of improving a manufacturing yield of a light-emitting diode.SOLUTION: A method of manufacturing a lead frame assembly includes: a step of preparing a metal plate material. A metal outer frame and a plurality of metal lead frames are molded to the metal plate material. The metal lead frame comprises: a first electrode piece; a second electrode piece; and a coupling part coupling the first electrode piece, the second electrode piece, and the metal outer frame. Electric plating is performed to the metal lead frame, and a rubber pedestal is formed on the metal lead frame. Thereafter, the coupling part coupling columns or rows in a vertical direction or in a lateral direction is cut, and steps for a light-emitting chip, a metal wire, and injection of an adhesive agent and the like are performed in a hollow function area of the rubber pedestal. Finally, a power supply is applied to the coupling part on the cut metal lead frame, and the first electrode piece and the second electrode piece are energized to lighten the light-emitting chip and perform testing of a blending ratio for luminance and chromaticity. |
