发明名称 CONDUCTIVE PASTE AND SUBSTRATE WITH CONDUCTIVE FILM
摘要 Provided in the present invention are a conductive paste which can form a conductive membrane having excellent conductivity and excellent bending resistance, and a substrate including a conductive membrane formed by using such conductive paste. The present invention relates to a conductive paste which contains (A) metallic particles having volume resistivity of 10 μΩ·cm or less and average diameter of 0.5-15 μm; (B) a silane component represented by Rx-Si-OR′4-x (Here, x is an integer number of one to three, R is an alkyl group with 1-25 carbon atoms independent from each other under a condition that the total number of carbon atoms of one to three alkyl groups is 30 or less, and OR′ is independently an alkoxy group with one to four carbon atoms;) and (C) a binder resin including a thermosetting resin having formaldehyde as one component, and is characterized by containing 5-25 parts by weight of the binder resin of component (C) and containing a silane compound of the component (B) for 100 parts by weight of sum of total components of the conductive paste.
申请公布号 KR20150029577(A) 申请公布日期 2015.03.18
申请号 KR20140118527 申请日期 2014.09.05
申请人 ASAHI GLASS COMPANY LTD. 发明人 AKAMA YUKI;HIRAKOSO HIDEYUKI;YONEDA TAKASHIGE
分类号 C09D5/24;H01B1/22 主分类号 C09D5/24
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