| 摘要 |
<p>Picking up semiconductor chips provided in wafer table, comprises detecting position of semiconductor chip using camera, and picking up semiconductor chip using chip gripper held on bonding head (8). The bonding head with chip gripper is movable using a pick system based on system of coordinates immanent to pick system. In a setup phase, adjustment of setpoint position of bonding head is performed. Movement of bonding head to setpoint position during adjustment and coordinates of setpoint position relating to system of coordinates of camera, is determined and stored. Picking up semiconductor chips provided in wafer table, comprises detecting position of semiconductor chip using camera, and picking up semiconductor chip using chip gripper held on bonding head (8). The bonding head with chip gripper is movable using a pick system based on system of coordinates immanent to pick system. In a setup phase, adjustment of setpoint position of bonding head is performed, where setpoint position is located in visual field of camera. Movement of bonding head to setpoint position during adjustment and coordinates of setpoint position relating to system of coordinates of camera, is determined and stored. In a production phase, readjustment of setpoint position is performed at the occurrence of predetermined event. An independent claim is included for method of mounting semiconductor chips on substrate.</p> |
