| 摘要 |
PROBLEM TO BE SOLVED: To provide a plasma processing apparatus capable of preventing thermal influence on an annular frame as well as preventing damages on a cover in plasma processing.SOLUTION: The plasma processing apparatus performs plasma processing on a substrate 2 held by a conveyance carrier 5 constituted of an annular frame 7 and a holding sheet 6. The plasma processing apparatus includes: a chamber 4 which has an inner space capable of reducing the pressure therein; a plasma source 12 that generates a plasma in the chamber 4; a stage 11 disposed in the chamber 4, on which a conveyance carrier 5 is placed; and a cover 28 which is placed above a stage 11 to cover the holding sheet 6 and the a frame 7, and which have a window part 32 formed penetrating the cover 28 in a thickness direction. The cover 28 is formed of a material superior in thermal conductivity. In the surface of the cover 28 which is exposed to the plasma, at least the window part 32 side is covered with a protect part 28a constituted of a material which has a low reactivity with the plasma. |
