RESIN COMPOSITION FOR PHOTOSEMICONDUCTOR PART, ENCAPSULATING MATERIAL OR SEAL MATERIAL FOR PHOTOSEMICONDUCTOR PART AND CURED PRODUCT

摘要

PROBLEM TO BE SOLVED: To provide a resin composition for a photosemiconductor part that gives a cured product having high optical characteristics and high stability.SOLUTION: The resin composition for a photosemiconductor part comprises (A) a heat-curable organosilicon compound, (B) a hydrosilylation catalyst and (C) a phenolic compound. The heat-curable organosilicon compound has one or more unsaturated bond groups and one or more hydrosilyl groups in a molecule and has a heterocyclic ring represented by the following formula (1). An encapsulating material or a seal material for a photosemiconductor part comprises the resin composition for a photosemiconductor part and a cured product is produced by heating and curing the encapsulating material or the seal material for a photosemiconductor part.