| 发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF INSPECTING THE SAME |
| 摘要 |
According to one embodiment, a semiconductor device includes a wiring board that has a first surface and a second surface opposed to the first surface, a semiconductor chip provided on the first surface, external connection terminals provided on the second surface, a sealing resin layer provided on the first surface, and a conductive shield layer that covers at least a portion of a side surface of the wiring board and the sealing resin layer. The wiring board includes a first ground wire that is electrically connected to the conductive shield layer, and a second ground wire that is electrically connected to the conductive shield layer and is electrically insulated from the first ground wire. |
| 申请公布号 |
US2015070046(A1) |
申请公布日期 |
2015.03.12 |
| 申请号 |
US201414474635 |
申请日期 |
2014.09.02 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
TAKANO Yuusuke;GOTO Yoshiaki;WATANABE Takeshi;IMOTO Takashi |
| 分类号 |
H01L23/552;H01L21/66;G01R31/04;G01R31/00;G01R31/26;H01L23/31;H01L23/00 |
主分类号 |
H01L23/552 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a wiring board having a first surface and a second surface; a semiconductor chip provided on the first surface; external connection terminals provided on the second surface; a sealing resin layer provided on the first surface; and a conductive shield layer covering at least a portion of a side surface of the wiring board and the sealing resin layer, wherein the wiring board includes
a first ground wire electrically connected to the conductive shield layer, anda second ground wire electrically connected to the conductive shield layer and electrically insulated from the first ground wire other than through the conductive shield layer, and the external connection terminals include
a first ground terminal electrically connected to the first ground wire, anda second ground terminal electrically connected to the second ground wire. |
| 地址 |
Tokyo JP |
