发明名称 METALLIC MATERIAL FOR ELECTRONIC COMPONENT, METHOD FOR PRODUCING THE SAME, AND CONNECTOR TERMINAL, CONNECTOR AND ELECTRONIC COMPONENT USING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a metallic material for an electronic component having low contact resistance and a low friction coefficient, thus having reduced insertion, and having low whisker properties, low adhesion wear properties and having high durability, and a connector terminal, a connector and an electronic component using the same.SOLUTION: Provided is a metallic material for an electronic component comprising: a base material; a lower layer formed on the base material and composed of one or more kinds selected from an A constituent element group as a group consisting of N, Cr, Mn, Fe, Co and Cu; an intermediate layer formed on the lower layer; an upper layer formed on the intermediate layer and composed of one or two kinds selected from a B constituent element group as a group consisting of Sn and In and one or more kinds of alloys selected from a C constituent element group as a group consisting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir; and a surface-treated layer formed on the upper layer and including a metal(s) composed of one or more kinds selected from a metallic element group composing the lower layer, the intermediate layer and the upper layer. The intermediate layer includes the metal(s) in the B constituent element group by 35 at% or higher.</p>
申请公布号 JP2015045053(A) 申请公布日期 2015.03.12
申请号 JP20130176118 申请日期 2013.08.27
申请人 JX NIPPON MINING & METALS CORP 发明人 FURUSAWA HIDEKI;SHIBUYA YOSHITAKA
分类号 C25D5/10;C22C5/02;C22C5/04;C22C5/06;C22C9/00;C22C13/00;C22C19/03;C22C19/07;C22C22/00;C22C27/06;C22C38/00;C23C22/58;C25D5/16;C25D5/48;C25D5/50;C25D7/00;C25D11/36;H01B5/02;H01B13/00 主分类号 C25D5/10
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