FABRICATING METHOD FOR FLEXIBLE PRINTED CIRCUIT BOARD AND HOT LAMINATION TYPE CUSHION PAD

摘要

The present invention relates to a method for fabricating a flexible printed circuit board which does not generate harmful chlorine gas causing a bad operation of a hot pressing process since a PVC film is not used unlike the existing hot pressing process, and to a cushion pad for multi-time thermal compression used therein. The cushion pad for multi-time thermal compression used in the method for fabricating a flexible printed circuit board comprises: a cushion pad unit including a cushion unit of a silicon material, and a base material unit made of a weaving material and coupled to the cushion unit; an adhesive layer applied to the base material unit of the cushion pad part; and a plate coupled to the adhesive layer, formed of a metal material, and closely contacted to a press in a thermo-compression process.