发明名称 LED ASSEMBLY
摘要 Disclosed are LED assemblies and their applications. An example LED assembly has an LED chip, a supportive structure and a transparent structure. The LED chip includes a transparent substrate, at least one LED cell, and two pads. The transparent substrate has a top surface with two terminals. The LED cell is formed on the top surface, and includes at least one light-emitting stack configured to emit light. The pad is formed on the top surface at the two terminals. The supportive structure has a transparent portion and a conductive portion. The conductive portion is connected to the transparent portion to fix the LED chip and supply electric power to at least one of the pads. The transparent structure encapsulates the LED cell.
申请公布号 US2015070871(A1) 申请公布日期 2015.03.12
申请号 US201414460943 申请日期 2014.08.15
申请人 HUGA OPTOTECH INC. ;Interlight Optotech Corporation 发明人 CHEN Tzer-Perng;CHENG Tzu-Chi
分类号 F21K99/00;F21S4/00 主分类号 F21K99/00
代理机构 代理人
主权项 1. A light emitting diode assembly, comprising: an LED chip, comprising: a transparent substrate having a top surface with two terminals;at least one LED cell formed on the top surface, wherein the LED cell includes at least one light-emitting stack configured to emit light; andtwo pads, formed on the top surface at the two terminals; a supportive structure, comprising: a transparent portion, transparent in view of the light emitted from the light-emitting stack; anda conductive portion, connected to the transparent portion, for fixing the LED chip and supplying electric power to at least one of the pads; and a transparent structure, encapsulating the LED cell.
地址 Taichung City TW