DEVICE AND METHOD FOR BAKING SUBSTRATE

摘要

A device and method for baking a substrate, the device comprising a hot plate (1), and support pieces (2) used to support a substrate to be machined (3) and located between the hot plate (1) and the substrate to be machined (3); and the support pieces (2) are movable relative to the hot plate (1) so as to adjust the contact position with the substrate to be machined (3). The device uniformly heats a substrate, thus improving the quality rate of the substrate.