MANUFACTURING METHOD OF WIDE-BANDGAP SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE, AND WIDE-BANDGAP SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a wide-bandgap semiconductor device capable of improving manufacturing yield of a semiconductor module.SOLUTION: A manufacturing method of a wide-bandgap semiconductor device comprises: a step of preparing a wide-bandgap semiconductor substrate; a step of dividing the wide-bandgap semiconductor substrate into a plurality of first semiconductor chips 80; a step of fixing the plurality of first semiconductor chips 80 to a fixing member 70; a step of measuring a withstand voltage of the first semiconductor chips 80 while at least the first semiconductor chips 80 are immersed in an inert fluid 91; a step of cutting the fixing member 70 after the step of measuring the withstand voltage of the first semiconductor chips 80 so as to obtain a plurality of second semiconductor chips in which the first semiconductor chip 80 is fixed to pieces of the fixing member 70 thus cut.