| 摘要 |
An integrated circuit device includes a substrate and a magnetic tunneling junction (MTJ). The MTJ includes at least a pinned layer, a barrier layer, and a free layer. The MTJ is formed on the surface of the substrate. Of the pinned layer, the barrier layer, and the free layer, the free layer is formed first and is closest to the surface. This enables a spacer to be formed on a peripheral region of the free layer prior to etching the free layer. Any damage to the free layer that results from etching or other free layer edge-defining processes is kept at a distance from the tunneling junction by the spacer. |
