| 摘要 |
The purpose of the present invention is to minify footprints. A bonding system according to the present invention includes a first process station, a second process station, and an input/output station. The first process station includes: a first transfer region, a spraying device, a thermal process device, and a first transfer block. Also, the second process station includes bonding devices, a second transfer region, and a second transfer block. The bonding device bonds a first substrate and a second substrate. The second transfer region is a region of transferring the first substrate and the second substrate with regard to the bonding device. The second transfer block transfers the first substrate, the second substrate and an overlapping substrate, between the first transfer region and the second transfer region. |
