| 发明名称 |
RADIO- AND ELECTROMAGNETIC INTERFERENCE THROUGH-SILICON VIAS FOR STACKED-DIE PACKAGES, AND METHODS OF MAKING SAME |
| 摘要 |
<p>An apparatus includes a radio-frequency die with shielding through-silicon vias and a die backside lattice lid that shield a sector in the RF die from radio- and electromagnetic interference.</p> |
| 申请公布号 |
EP2705532(A4) |
申请公布日期 |
2015.03.11 |
| 申请号 |
EP20120779644 |
申请日期 |
2012.04.27 |
| 申请人 |
INTEL CORPORATION |
发明人 |
KAMGAING, TELESPHOR;RAO, VALLURI R. |
| 分类号 |
H01L23/66;H01L23/48;H01L23/552;H01L25/18;H05K9/00 |
主分类号 |
H01L23/66 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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