| 摘要 |
A semiconductor chip includes a first data pad, a first data strobe pad, and a second data pad which are successively formed in a first direction of a command address pad in which a command and an address are inputted and outputted, a third data pad, a second data strobe pad, and a fourth data pad which are successively formed in a second direction of the command address pad. Data is inputted to or outputted from the first and fourth data pads or the second and third data pads in a preset bit structure. |
