发明名称 Method for improving plating on non-conductive substrates
摘要 A method of treating a laser-activated thermoplastic substrate having a metal compound dispersed therein is described. The substrate is contacted with an aqueous composition comprising: (i) a thiol functional organic compound; (ii) an ethoxylated alcohol surfactant; and (iii) xanthan gum. By use of the treatment composition, when the substrate is subsequently laser-activated and plated by electroless plating, extraneous plating of the substrate is substantially eliminated.
申请公布号 US8974869(B2) 申请公布日期 2015.03.10
申请号 US201012693548 申请日期 2010.01.26
申请人 发明人 Hamilton Robert;Long Ernest;Krol Andrew M.
分类号 B05D1/18;B05D3/00;C08J7/18;B05D3/06;C23C18/16;C23C18/20;C23C18/38;H05K3/18 主分类号 B05D1/18
代理机构 Carmody Torrance Sandak & Hennessey LLP 代理人 Carmody Torrance Sandak & Hennessey LLP
主权项 1. A method of treating a laser-activatable non-conductive substrate, the method comprising the steps of: a) treating the non-conductive substrate with an aqueous composition comprising: i) a thiol functional organic compound; andii) preferably, a surfactant; b) selectively laser activating portions of a surface of the non-conductive substrate; c) contacting the substrate with an electroless plating bath such that areas of the substrate which were contacted by the laser plate, but areas that were not contacted by the laser do not plate.
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