发明名称 Dual work function FinFET structures and methods for fabricating the same
摘要 A method for fabricating a dual-workfunction FinFET structure includes depositing a first workfunction material in a layer in a plurality of trenches of the FinFET structure, depositing a low-resistance material layer over the first workfunction material layer, and etching the low-resistance material layer and the first workfunction material layer from a portion of the FinFET structure. The method further includes depositing a second workfunction material in a layer in a plurality of trenches of the portion and depositing a stress material layer over the second workfunction material layer.
申请公布号 US8975141(B2) 申请公布日期 2015.03.10
申请号 US201213563202 申请日期 2012.07.31
申请人 GLOBALFOUNDRIES, Inc. 发明人 Wei Andy C.;Yang Bin;Tambwe Francis M.
分类号 H01L21/336 主分类号 H01L21/336
代理机构 Ingrassia Fisher & Lorenz, P.C. 代理人 Ingrassia Fisher & Lorenz, P.C.
主权项 1. A method for fabricating a dual-workfunction FinFET structure, comprising: depositing an n-type workfunction material in a layer over a plurality of gate structures of each a PMOS and an NMOS and in a plurality of trenches between said gate structures; depositing a low-resistance material layer over the n-type workfunction material layer; depositing a deep ultraviolet light-absorbing oxide (DUOS material layer over the plurality of gate structures of the NMOS; etching the low-resistance material layer and the n-type workfunction material layer from the PMOS; etching the DUO material layer from over the NMOS; depositing a p-type workfunction material in a layer over the plurality of gate structures of the PMOS and in the plurality of trenches between said gate structures of the PMOS; and depositing a compressive stress material layer over the p-type workfunction material layer.
地址 Grand Cayman KY