| 发明名称 | Heat sink for measuring temperature of electronic component | ||
| 摘要 | There is provided a heat sink for measuring temperature of electronic component. The heat sink includes a heat radiating plate, a fin, a heat receiving plate, and a temperature detector. The heat radiating plate has a first surface that receives heat from the electronic component. The fin is for radiating heat energy conducting through the heat radiating plate and is connected to the heat radiating plate. The heat receiving plate arranged apart from the heat radiating plate has a second surface movable to be parallel to the first surface. The temperature detector that detects a temperature is disposed on the heat receiving plate. | ||
| 申请公布号 | US8974116(B2) | 申请公布日期 | 2015.03.10 |
| 申请号 | US201012730811 | 申请日期 | 2010.03.24 |
| 申请人 | Fujitsu Limited | 发明人 | Okamoto Tomomi;Yamada Hiroshi;Ito Ryuji;Higashi Osamu |
| 分类号 | G01K17/00;G01K1/00;G01K7/00;G01K13/00;G01K1/14;H01L23/34 | 主分类号 | G01K17/00 |
| 代理机构 | Staas & Halsey LLP | 代理人 | Staas & Halsey LLP |
| 主权项 | 1. A heat sink for measuring a temperature of an electronic component, comprising: a heat radiating plate having a first surface that receives heat from the electronic component; a fin that connects to the heat radiating plate, and that radiates heat energy conducting through the heat radiating plate; a heat receiving plate arranged apart from the heat radiating plate and having first and second surfaces movable to be parallel to the surface of the heat radiating plate; and a temperature detector that detects a temperature and that is disposed on the heat receiving plate, wherein, at least a portion of the first surface of the heat radiating plate and at least a portion of the second surface of the heat receiving plate are capable of contacting at least a portion of a first surface of the electronic component. | ||
| 地址 | Kawasaki JP | ||