A COMPOSITION OF EPOXY RESIN, METHOD FOR MANUFACTURING THE COMPOSITION, ADHESION SHEET, CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE CIRCUIT BOARD

摘要

The present invention provides an epoxy resin composition having excellent heat resistance, peeling strength, and heat radiation, wherein the same especially has excellent stress relieving properties to exhibit excellent properties against heat shock. The epoxy resin composition includes 5-10 parts by weight of a multifunctional epoxy resin compound, 1-6 parts by weight of a rubber denatured epoxy resin, 5-15 parts by weight of a PPG denatured multifunctional acid anhydride hardening agent, and 69-89 parts by weight of an inorganic filler.