| 摘要 |
<p>The heat sink (1) comprises a main heat exchange zone (3) in contact with a processor. A peripheral heat exchange zone (4) is provided in thermal contact with a cooling source. A heat pipe (5) is provided for connecting the main heat exchange zone with the peripheral heat exchange zone. The heat pipe contains a cooling fluid. The main heat exchange zone is provided with a plane bearing surface in contact with the processor. The peripheral heat exchange zone is provided with a plane bearing surface in contact with a cold source. An independent claim is included for an electronic board comprises a support, a processor and a cold source.</p> |
