| 发明名称 |
MEMS Device |
| 摘要 |
A MEMS device includes a first chip and a MEMS chip. The first chip has a mounting surface and includes at least an integrated circuit. The MEMS chip has a main surface on which a first set of contact pads for contacting the MEMS device and a second set of contact pads for contacting the first chip are arranged. The first chip is mechanically attached and electrically connected to the second set of contact pads via the mounting surface facing the main surface. The mounting surface of the first chip is at least 25% smaller than the main surface of the MEMS chip. |
| 申请公布号 |
US2015061045(A1) |
申请公布日期 |
2015.03.05 |
| 申请号 |
US201314011621 |
申请日期 |
2013.08.27 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Fuergut Edward;Theuss Horst |
| 分类号 |
B81B7/00;B81C1/00 |
主分类号 |
B81B7/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A MEMS device, comprising:
a first chip having a mounting surface and comprising at least an integrated circuit; and a MEMS chip having a main surface, wherein a first set of contact pads for contacting the MEMS device and a second set of contact pads for contacting the first chip are arranged on the main surface; wherein the first chip is mechanically attached and electrically connected to the second set of contact pads via the mounting surface facing the main surface; and wherein the mounting surface of the first chip is at least 25% smaller than the main surface of the MEMS chip. |
| 地址 |
Neubiberg DE |
