| 摘要 |
PROBLEM TO BE SOLVED: To reduce the cost of processing an external lead-out terminal by a press, improve the formability of a block part of an enclosure case, and secure a free space beneath the block part of the enclosure case.SOLUTION: Provided is a power semiconductor module 100 of doubler type comprising an enclosure case 6 into which a plurality of external lead-out terminals 6a, 6b, 6c formed by press-working of a metal material are inserted, the enclosure case 6 being formed by molding an electrically insulating resin material and diode chips 3a, 3b. A connection part 6a5 of the external lead-out terminal 6a is formed in shape of a circular arc cylinder, and the whole of an inner circumferential face 6a5a and an outer circumferential face 6a5b is covered by a block part 6g1 of the enclosure case 6. An underside 6g1b of the block part 6g1 is set to a position lower than an underside 6a2b of an upper horizontal portion 6a2 of the external lead-out terminal 6a, and a right edge part 6a2b1b and a left edge part 6a2b1c of an adjacent portion 6a2b1 beneath the upper horizontal portion 6a2 are covered by the block part 6g1, a central part 6a2b1a of the adjacent portion 6a2b1 being exposed without being covered by the block part 6g1. |
