| 摘要 |
The present invention is an ingot cutting method involving forming wire rows with axially running wires wound in a spiral shape between a plurality of wire guides, and pressing an ingot into contact with the wire rows while supplying a processing liquid to a section where contact is made between the ingot and the wires whereby the ingot is cut into wafers, wherein the method is characterized in that the ratio of the amount of new wire supplied per unit of time, when cutting the first ingot after replacing the wires, for the cutting of an initially cut portion versus the cutting of a central portion of the ingot is controlled so 1/2 or less of the ratio when a second or subsequent ingot is cut after the wires are replaced. Thereby provided are an ingot cutting method and a wire saw for suppressing variation in thickness unevenness between wafers cut out from the first ingot and second or subsequent ingot after the wires are replaced. |
