发明名称 Device securing plates for e.g. electroplating - has lower support and upper securing device to clip plate in place
摘要 Device onto which plates can be secured consists of a lower support onto which the plate is placed and an upper securing device (3) to clip the plate in place. Some lateral guide elements (5) and some compensating elements (6), contg. a spring (14), are mounted on the lower support (2). The plates (1) are placed between the lateral guide elments (5) and press against the springs (14). The securing device (3) comprises a number of pinching couples (8,8') mounted on a carryi caryring rack bar (7) and a number of lateral thrust elements (10) arranged to allow the vertical and horizontal positioning of the plate prior to clipping them between the teeth of the pinching couples (8,8'). USE/ADVANTAGE - The device is used for securing plates for subsequent electroplating or other chemical treatments involving successive treatment baths, e.g. boards used for printed circuits. Its design allows the securing of the plates to be carried out automatically with precise positioning of the pinches on the plates and ensures a good transmission of electrical current between the pinches and the plates. Since the securing of the plates can be carried out automatically the handling required at the start and end of treatment is considerably reduced with a consequent reduction in the overall treatment cycle time.
申请公布号 CH667675(A5) 申请公布日期 1988.10.31
申请号 CH19860003268 申请日期 1986.08.14
申请人 STS SYSTEMES DE TRAITEMENTS DE SURFACES S.A. 发明人 KOWALCZYK, WIESLAW
分类号 C25D17/06;H05K3/24;(IPC1-7):C25D17/06 主分类号 C25D17/06
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