| 摘要 |
Some novel features pertain to a substrate that includes a first dielectric layer, a first interconnect, a first cavity, and a second interconnect. The first dielectric layer includes first and second surfaces. The first interconnect is embedded in the first dielectric layer. The first interconnect includes a first side and a second side. The first side is surrounded by the first dielectric layer, where at least a part of the second side is free of contact with the first dielectric layer. The first cavity traverses the first surface of the first dielectric layer to the second side of the first interconnect, where the first cavity overlaps the first interconnect. The second interconnect includes a third side and a fourth side, where the third side is coupled to the first surface of the first dielectric layer. |
