SUBSTRATE DIVIDING APPARATUS

摘要

The objective of the present invention is to provide a substrate cutting device which can efficiently cut a brittle material substrate having a resin or metal surface layer with a simple tool without using a breaking edge. To achieve the objective of the present invention, the substrate cutting device, which has a resin or metal thin surface layer (2) stacked on the upper surface of a substrate body (1) and a plurality of scribe lines formed on the lower surface of the substrate body (1), comprises: a conveyor (3) to convey a substrate (W) mounted thereon in a state of arranging the scribe line of the substrate (W) in a direction perpendicular to the conveying direction or downward; a ridge unit (4) formed in the intermediate position of the conveying direction of the conveyor (3); and an elastic member (5) provided above the ridge unit (4) to be elastically in contact with the upper surface of the substrate (W) conveyed by the conveyor (3), wherein the ridge unit (4) is raised than a conveyor mounting surface (a) to be bent upward when the substrate (W) climbs over the corresponding ridge unit (4).