| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive composition for a flexible printed wiring board having halogen-free flame retardancy and high heat resistance compatible with lead-free solder, and a coverlay film. <P>SOLUTION: The adhesive composition for a flexible printed wiring board comprises an acrylic elastomer (A), a thermosetting component (B), pyrogallol (C), a metal phosphinate (D), an inorganic filler (E), and a silicone oligomer (F). The metal phosphinate (D) is one or more selected from aluminum phosphinate, calcium phosphinate and zinc phosphinate. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
