Method of manufacturing a multilayered printed wiring board

摘要

A method of manufacturing a multilayered printed wiring board including forming a multilayered core substrate including insulation layers and one or more stacked via structures formed through the insulation layers, the stacked via structure including vias formed in the insulation layers, respectively, the insulation layers in the multilayered core substrate including at least three insulation layers and each of the insulation layers in the multilayered core substrate including a core material impregnated with a resin, and forming a build-up structure over the multilayered core substrate and including interlaminar insulation layers and conductor circuits, each of the interlaminar insulation layers including a resin material without a core material.

主权项

1. A method of manufacturing a multilayered printed wiring board, comprising:
forming a multilayered core substrate comprising a plurality of insulation layers and at least one stacked via structure formed through the plurality of insulation layers, the stacked via structure comprising a plurality of vias formed in the plurality of insulation layers, respectively, each of the insulation layers in the multilayered core substrate comprising a core material impregnated with a resin; and forming, over the multilayered core substrate, a build-up structure comprising a plurality of interlaminar insulation layers and a plurality of conductor circuits, each of the interlaminar insulation layers comprising a resin material without a core material, wherein the forming of the multilayered core substrate comprises forming the plurality of insulation layers having a number of layers which is 2N+1 where N is a natural number and forming the vias in the stacked via structure in a tapered shape such that a first via group is formed in N+1 layers of the insulation layers, that a second via group is formed in N layer or layers of the insulation layers, and that the first via group and the second via group face in opposite directions, and the forming of the build-up structure comprises forming at least one via over the first via group formed in the N+1 layers of the insulation layers and forming at least one via over the second via group formed in the N layer or layers of the insulation layers.