发明名称 VACUUM CHUCKING HEATER OF AXISYMMETRICAL AND UNIFORM THERMAL PROFILE
摘要 <p>Embodiments of a vacuum chuck having an axisymmetrical and/or more uniform thermal profile are provided herein. In some embodiments, a vacuum chuck includes a body having a support surface for supporting a substrate thereupon; a plurality of axisymmetrically arranged grooves formed in the support surface, at least some of the grooves intersecting; and a plurality of chucking holes formed through the body and within the grooves, the chucking holes for fluidly coupling the grooves to a vacuum source during operation, wherein the chucking holes are disposed in non-intersecting portions of the grooves.</p>
申请公布号 KR101495513(B1) 申请公布日期 2015.03.03
申请号 KR20110040280 申请日期 2011.04.28
申请人 发明人
分类号 H01L21/687 主分类号 H01L21/687
代理机构 代理人
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