发明名称 METHOD OF MANUFACTURING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component which can suppress variation of a coating amount of resin.SOLUTION: A coating process of coating one substrate 10 with resin 20 is carried out at a plurality of times. A coating amount per unit time R1 in the coating process just before the last coating process is calculated from a coating amount of the resin 20 and a coating time of the resin 20 in the coating process just before the last coating process by measuring a weight of the resin 20 coated in the coating process just before the last coating process. A coating time in the last coating process T2=(Me-P1)/R1 is calculated based on a difference Me-P1 between a target coating amount to be coated on the substrate 10 and the coating amount of the resin 20 coated in the processes just before the last coating process, and the calculated coating amount per unit time R1. In the last coating process, the resin 20 is coated on the substrate 10 for the calculated coating time T2.
申请公布号 JP2015039661(A) 申请公布日期 2015.03.02
申请号 JP20130171139 申请日期 2013.08.21
申请人 MURATA MFG CO LTD 发明人 KAWAI HIDEMASA;TANIGUCHI TETSUYA
分类号 B05D3/00;B05D7/00;H01L21/56;H01L25/04;H01L25/18 主分类号 B05D3/00
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