发明名称 Heating structure
摘要 <p>A heating structure (100) used for heating a building is disclosed. The heating structure or ondol panel comprises: a heat insulator (110), which is disposed at the top surface of the structure; an under-floor heating panel (200), which is disposed at the top surface of the heat insulator and has an inlet (212) and an outlet (213) for a hot water flow formed inside thereof; a pipe housing (300), which is adapted to have a top surface level with the top of the heat insulator and has a connection pipe receiver (310) inside. A hot water supply pipe (420) is arranged in the connection pipe receiver, with one end being connected to the inlet and the other end being connected to a hot water supplier. With the use of this heating structure, the construction period can be shortened because there is no need to wait until the cement on the floor is cured, and furthermore construction costs can be reduced as well. Moreover, when one of the under-floor heating panels has a water leak, only the corresponding panel having such a problem needs to be replaced, thereby facilitating the maintenance process. The ondol panel includes an upper plate and a lower plate separately manufactured, a passage being formed in each of surfaces of the upper and lower plates to be coupled to each other. The plates are bonded to each other to form the hot water passage directly contacting the hot water.</p>
申请公布号 NZ601666(A) 申请公布日期 2015.02.27
申请号 NZ20110601666 申请日期 2011.01.28
申请人 SANG WON LEE 发明人 LEE SANG WON
分类号 F24D3/12;E04F15/00;E04F15/08;E04F15/18;F24D3/16 主分类号 F24D3/12
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