发明名称 CONDUCTIVE PARTICLES, CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
摘要 <p>PROBLEM TO BE SOLVED: To provide conductive particles in which, when electrically connecting between electrodes, the connection resistance can be reduced, and connection reliability can be improved.SOLUTION: A conductive particle 1 comprises a base material particle 2, and a conductive part 3 disposed on the surface of the base material particle 2. The base material particle 2 comprises an organic core 2 A, and an inorganic shell 2B disposed on the surface of the organic core 2 A. The conductive part 3 has a plurality of projections 3a on the external surface. The material of the external surface of the conductive part 3 is ductile metal with 5% or more and 65% or less of elongation percentage at 23°C.</p>
申请公布号 JP2015038865(A) 申请公布日期 2015.02.26
申请号 JP20140144908 申请日期 2014.07.15
申请人 SEKISUI CHEM CO LTD 发明人 O GYOKA
分类号 H01B5/00;H01B1/00;H01B1/02;H01B1/22;H01R11/01 主分类号 H01B5/00
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