WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD, AND COMPONENT BUILT-IN GLASS SUBSTRATE AND COMPONENT BUILT-IN GLASS SUBSTRATE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To compose a component built-in glass substrate which incorporates even a large sized component and a component having no heat resistance to achieve a compact size and thin device body.SOLUTION: In a wiring board manufacturing method, a through hole and a cavity, which conform to a shape of a component to be mounted on a component mounting substrate are provided on a wiring board to be bonded with the component mounting substrate and bonding by a photocurable resin is performed to compose a component built-in glass substrate. Accordingly, since a glass substrate which incorporates even a large sized component and a component having no heat resistance can be composed and the substrate itself can be employed as an outer package of a housing, a thin and compact size electronic apparatus can be achieved. The present art can be applied to a smart phone.