| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor module capable of applying a pressure to a resin sheet disposed between heat spreaders and a radiator.SOLUTION: A semiconductor module includes a resin sheet 30 which bonds and couples heat spreaders 24, on which semiconductor chips 22 are placed, and a bonding surface 32 of a radiator 26 having fins 26b. The semiconductor chips 22 are positioned so as to overlap with fin regions occupied by the fins 26b. An end part of each heat spreader 24 is positioned at a non-fin region located at the outer side of the fin region.</p> |
