| 摘要 |
The present invention relates to: a resin composition, a printed circuit board using the same, and a method for manufacturing the same. According to the present invention, disclosed is the resin composition including a photopolymerizable compound including an ethylene unsaturated bonds capable of being polymerized in a molecule, a photoinitiator, and silica of which the surface is modified with a sulfonated alkyl tetrazole compound. |
