| 摘要 |
<p>The present invention provides a multilayer ceramic electronic component embedded on a substrate which includes: a ceramic body which includes a dielectric layer, first and second main surfaces to face each other, first and second sides to face each other, and first and second cross sections to face each other; multiple first and second internal electrodes which are alternately exposed through both cross sections of the ceramic body while interposing the dielectric layer; a dielectric dummy layer which is formed on a margin part of the longitudinal direction of the ceramic body on which the first and second internal electrodes are not formed; and first and second external electrodes which are formed on both cross sections of the ceramic body. The first external electrode includes a first bottom electrode and a first terminal electrode which is formed on the first bottom electrode. The second external electrode includes a second bottom electrode and a second terminal electrode which is formed on the second bottom electrode. If the thickness of the ceramic body is ts and the thickness of the dielectric dummy layer is td, the present invention provides the multilayer ceramic electronic component embedded on the substrate, capable of satisfying 0.03<=td/ts<=0.07.</p> |
