| 摘要 |
Disclosed are a device and a method for manufacturing a semiconductor chip package with an attached film, such as an LED package with an attached light emitting film. The device for manufacturing a semiconductor chip package includes a lead frame loading unit sequentially loading a lead frame, a resin dispensing unit injecting sealing resin into the lead frame to seal a chip accepting part of the lead frame, a film stage moved to sequentially place a fluorescent film piece on a pick-up position, a film attaching unit absorbing the fluorescent film piece to sequentially attach the piece to the sealing resin of the lead frame, and a lead frame unloading unit collecting the lead frame by unloading the lead frame passing through the film attaching unit. |
