| 摘要 |
<p>The present invention relates to a light emitting device package and to a method for manufacturing the same. According to an embodiment, the light emitting package includes: a main body which includes a lead frame; and a light emitting laminate which is installed on the main body and is connected electrically to the lead frame. The light emitting laminate has a plurality of layer structures in which a plurality of light emitting devices is laminated with each other, and the upper light emitting device among the light emitting devices is laminated to have the vertex of a lower layer of the light emitting device dislocated from the vertex position of the upper light emitting device so as for the lower layer of the light emitting device to be exposed partially to the outside.</p> |
