Electronic device and method of manufacturing electronic device

摘要

An electronic device includes: a first electronic component 10; first members 13 that are provided on a first surface of the first electronic component and that include outside surfaces 13a configured to face diagonally upward with respect to the first surface; a second electronic component 20 provided above the first surface; second members 23 that are provided corresponding to the first members on a second surface of the second electronic component which faces the first surface and that include inside surfaces 23a configured to face diagonally downward with respect to the second surface and configured to face the outside surfaces; and solder 30 that is provided between the first surface and the second surface and that electrically connects the first electronic component and the second electronic component.