发明名称 Dressing method, method of determining dressing conditions, program for determining dressing conditions, and polishing apparatus
摘要 A method dresses a polishing member with a diamond dresser having diamond particles arranged on a surface thereof. The method includes determining dressing conditions by performing a simulation of a distribution of a sliding distance of the diamond dresser on a surface of the polishing member, and dressing the polishing member with the diamond dresser under the determined dressing conditions. The simulation includes calculating the sliding distance corrected in accordance with a depth of the diamond particles thrusting into the polishing member.
申请公布号 US8965555(B2) 申请公布日期 2015.02.24
申请号 US201414150068 申请日期 2014.01.08
申请人 Ebara Corporation 发明人 Fukuda Akira;Mochizuki Yoshihiro;Wada Yutaka;Shiokawa Yoichi;Hiyama Hirokuni
分类号 G06F19/00;G05B11/01;G05B19/18;B24B49/00;B24B1/00;G01D1/00;G06F17/50;B24B53/017 主分类号 G06F19/00
代理机构 Wenderoth, Lind & Ponack, L.L.P. 代理人 Wenderoth, Lind & Ponack, L.L.P.
主权项 1. A method of dressing a polishing member with a diamond dresser while moving the diamond dresser and the polishing member relative to each other, the diamond dresser having diamond particles arranged on a surface thereof, said method comprising: determining dressing conditions by performing a simulation of a distribution of a sliding distance of the diamond dresser on a surface of the polishing member; and dressing the polishing member with the diamond dresser under the dressing conditions determined, wherein said simulation includes (i) calculating sliding distances of the diamond dresser at respective predefined points on the surface of the polishing member, and (ii) correcting the calculated sliding distances by multiplying the calculated sliding distances by correction factors, respectively, which vary such that differences between the calculated sliding distances are reduced.
地址 Tokyo JP